Beyond the obvious engineering effort that has gone into creating one of the slimmest phones ever made, the Air is a reductive exercise that boils down the iPhone into the absolute essentials in a premium body.
Number (1): Everything in this space must add up to 1. The answer is 4-0, placed horizontally; 0-0, placed vertically; 1-1, placed horizontally.
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以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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